PC Engines APU2E4 Rack Bundle – Board, Power Supply, 19″ Rack Enclosure

Cost-efficiency through a space- and energy-saving network component.

The APU2E4 19″ rack bundle

Thanks to its modular architecture, this hardware can be used for more than 50 different applications in the field of embedded devices, such as broadband management, security applications (firewalls) and routing. The boards can be used for multimedia applications as well as WLAN access points or VPN gateways.

APU2E4 is compatible with MikroTik OS, PC ENGINES, ZEROSHELL, MONOWALL and OpenThinClient.

• APU2E update: The size of the battery socket has been changed to avoid contact problems. Added signal integrity resistor for core voltage control signal.

The DualRack enclosure

As a high-quality and modular 19″ rack system, the VARIA 19″ DualRack system offers compatibility for PC Engines APU boards. Hard disks, fans and an internal power supply unit can be optionally mounted. The high-quality material (galvanised steel, powder-coated black front panel) ensures the necessary stability and durability.

Scope of delivery:

• 19″ DualRack enclosure with suitable front panel
• 1x APU2E4 board, 3x LAN, 1 GHz, 4 GB DDR3 RAM, IDE, USB, RTC battery
• 1x internal power supply (12 V, 3 A)
• 1x suitable connection cable for connecting the APU board to the internal power supply

The unit comes pre-assembled.

• CPU: AMD Embedded G Series GX-412TC, 1 GHz Quad Jaguar Core with 64 bit and AES-NI support, 32K data + 32K instruction cache per core, shared 2 MB L2 cache
• DRAM: 4 GB DDR3-1333 DRAM
• Storage: boot from mSATA-SSD, SD card (internal sdhci controller) or external via USB, 1x SATA + power connector
• 12 V DC, around 6 to 12 W depending on CPU load, built-in socket = 2.5 mm, positive inner conductor
• Connectivity: 3 Gigabit Ethernet channels (Intel i211 NIC)
• I/O: serial DB9 interface, 2x USB 3.0 external + 2x USB 2.0 internal, 3x LEDs on the front, push-buttons
• Extension: 2x miniPCI-express (1x with SIM connector), LPC bus, GPIO header, I2C bus, COM2 (3.3 V RXD/TXD)
• Board size: 6 x 6″ (152.4 x 152.4 mm) – like apu1d, alix2d13 and wrap1e
• Firmware: Coreboot
• Cooling: Conductive cooling from CPU to case with 3 mm thick aluminium heatspreader (included)