Delock – 18471 – Delock thermal pad 120 x 20 x 3 mm for M.2 modules 3,2 WmK – Low Oil Bleeding

This thermal pad by Delock is suitable for heat dissipation, for example on an M.2 module. The aim of the pad is to improve the performance and increase the service life of the components.

Low oil bleeding

This pad emits very little oil, which protects the electronic components and contacts from contamination and can offer a longer service life. Pads with “low oil bleeding” retain their thermal and mechanical properties better and therefore ensure even and stable heat dissipation.

Technical data

– Thermal conductive pad for heat dissipation

– Low oil bleeding

– Thermal conductivity: 3.2 W/mK

– Operating temperature: -60 °C ~ 180 °C

– Colour: grey

– Dimensions (LxWxH): approx. 120 x 20 x 3 mm

Package contents

1 x thermal conductive pad